Vtc-600-2HD DC RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater

Application: Lab
Customized: Non-Customized
Certification: CE
Structure: Desktop
Material: Aluminum
Type: Heating Mantle
Customization:
Manufacturer/Factory, Trading Company
Gold Member Since 2024

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Shandong, China
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Basic Info.

Model NO.
VTC-600-2HD
Transport Package
Carton Box
Specification
360× 260× 260mm
Origin
Shandong
HS Code
8422400000
Production Capacity
200

Product Description

VTC-600-2HD DC RF Dual-Head High Vacuum 2" Magnetron Plasma Sputtering Coater
 
 VTC-600-2HD is a magnetron sputtering system featuring dual target sources: 1) DC source for coating metallic material on one head and 2) RF source for coating non-metallic material on the other head. It is equipped with a film thickness tracker to enable the user to easily monitor the coating progress and also record the data. 
   This model is sophsticatedly designed for coating single or multiple film layers of a wide range of substrate materials (ferroelectric, condutive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE and etc). Its compactness and ease of operation make it an ideal coating system for use in R&D labs. 

SPECo
Compact Structure  
Input Power
  • 220VAC 50/60Hz, single phase
  • 2000W  (including pump)
Source Power

 
Two sputtering power sources are integrated into one control box  ( click picture below to see detailed specs )

 
  • DC source: 500W for coating metallic materials ( below left)
  • RF source: 600W with automatching for coating non-metallic materials ( Center)
  • Compact 300 RF source is available at extra cost ( Below right)
                  
Magnetron Sputtering  Head
  • Two 2" Magnetron Sputtering  Heads with water cooling jackets are included ( click picture-left to see detailed specs )
    • One is connected to RF power supply for no-conductive materials
    • Another is connected to DC sputtering power source for coating metallic materials
  • Target size requirement: 2" diameter
    • 1/16" max. thickness for metallic targets
    • 1/4" max. thickness for no-conductive targets
    • One stainless steel and one Al2O3 ceramic targets are included for demo testing
  • Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads
       
  • Customized coater:  two RF head without DC sputering, 3 RF head are available upon request
Vacuum Chamber
  • Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
  • Observation Window:  100 mm diameter
  • Hinged type cover on top with air spring sport makes target exchange easy
     
Sample Holder
  • Sample holder size: 140mm dia. for. 4" wafer max
  • Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
  • The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C
   
Gas Flow Control
 
  • Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in
  • Flow rate:  200 ml/min max.
  • Flow rate is adjustable on the 6" touch screen control panel
     
Vacuum Pump Station
  • High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level
  • Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed
  • Mobile pump station is included and the compact sputtering coater can be put on top of station
  • Max. vacuum level: 10^-6 torr with chamber baking
     
Thickness Monitor

 
  • One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å  
  • LED Display Unit outside chamber can:
    • Input material to be coated according to data base included
    • Display total thickness coated and coating speed
  • 5 pcs quartz sensors (consumable) are included 
     
  • Water cooling is required
   
Overall Dimensions L1300mm× W660mm× H1200mm
Net Weight 160 kg
Warranty One years limited warranty with lifetime support
Operation Instruction  
Application Note
  • In order to remove oxygen from the chamber,  suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm
  • Please use > 5N purity Argon gas for plasma sputtering.  Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O dependedon  supplier.  Strongly suggest you use gas purification device listed below to purify gas before filling in:  ( click pic to order )
  • MTI supply single crystal substrate from A to Z ( click picture below-right to order )
                
 
 
 

RFQ
1, Min. Order Quantity
1 piece is OK.
2. How about your technical team construction?
We have professional technicians team with 10 years' experience.
3, What's our warranty?
12 months
4, Ways of payment
T/T, L/C, Pay pal, Western Union
5, Ways of shipment
EXW, FOB, DHL, FedEx, or upon your requirements
6, Are you a trader or manufacture?
We are manufacturer, owns our factory in Shandong .
7, Can you accept OEM or ODM?
Of course,Logo is also acceptable
8, What is the delivery time?
No special requirements, can be delivered within 15 days. For customized models, delivery time shall be discussed and confirmed according to order
 


 

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