Customization: | Available |
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Blade Type: | Continuous Boundary |
Manufacturing Process: | Electroplating |
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Model: | SYJ-160 Low Speed Diamond Saw | ||||||||||||||||||||||||||||||||||||||||||||
Brief Introduction: | SYJ-160 Low Speed Diamond Saw is specialized designed to material researchers, the products sells to research institutes, universities and research department of famous companies, small and medium-sized companies for the relevant material analysis. Many artificial crystal precision cutting also can use this machine. | ||||||||||||||||||||||||||||||||||||||||||||
Main Feature: |
Used for precision cutting the material sample, high torque, running steady, can cut all kinds of materials and the thickness are 0.1mm. Suitable for samples' follow-up thinning, polishing and various operation. The different between SYJ-160 and SYJ-150 is the former can use various blades of 150mm(outside diameter). It's good for cutting bigger samples. Original equips with digital micrometer. |
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Technical Parameter: |
1. Speed range:20-600RPM stepless speed adjust 2. Voltage:AC 110V/220V 3. Position accuracy:0.01mm( Mechanical and digital display ) 4. Two dimension, angle adjustment: 360(H),(+/-)15(V) 5. Max. travel distance:50mm(Fine adjustment travel distance 25mm) 6. Max dia. wafer blade:150mm(6 inches) 7. Automatic shut off:allowed unattended 8. Digital display axis RPM |
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Specification: | Size:400 x300 x30mm Weight:14.5kg | ||||||||||||||||||||||||||||||||||||||||||||
Standard Accessories: |
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Optional Accessories : | 1. Edge sintered Diamond Blade:Φ150x12.7x0.55 2. Full sintered Diamond Blade:Φ150x12.7x0.50 3. Sic blade:Φ150x12.7x0.55 4. Al2O3 blade:Φ150x12.7x0.55 5. Electroplating diamond blade:Φ150x12.7x0.40 6. (Optional)All kinds of blades:Φ100x12.7x0.4 |