| Customization: | Available |
|---|---|
| Blade Type: | Continuous Boundary |
| Manufacturing Process: | Electroplating |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Model: | SYJ-800 Cutting/Dicing Saw | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Brief Introduction: | SYJ-800 Cutting/Dicing Saw is mainly used for dicing and cutting all kinds of crystal, glass, ceramic, mineral, metal. It can realize the computer 3D automatic control. Dicing crystal wafer's diameter can reach to 200mm, cutting accuracy can reach to 0.02mm. It's one of the best precision cutting saw for lab and factory's manufacturing. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Main Feature: | 1. Single board computer and normal computer can be used to control this machine, allowing user to program, manual cutting and dicing. 2. 0.5 hp high torque brushless DC motor, can reach to 0-3000 r/min,voltage: 110V-220V. 3. PC controlled stepping motor driving resolution 0.0025mm,position accuracy 0.01mm. 4. Manual control / Automatic digital control by control box .Equip with exquisite sample spinning platform, can turn 360°, cutting angle tolerance + /-0.5° . 5. Equip with precision φ200mm vacuum chuck, andφ200mm glass or ceramic resin sample holder. 6. Suited blade and blades clamp can be choice according to cutting materials' dimension. 7. Water-proof system and splashing protection,throttle valve adjust the cutting liquid flow. |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Technical Parameter: |
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Specification: | 700mm×530mm×750mm |
){kind=link}