| Customization: | Available |
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| Max Diameter of Workpiece: | 300 |
| Mass Scope of Workpiece: | <900kg |
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| UNIPOL-160D Mini Double Edge Auto Polishing Machine | |||
UNIPOL-160DMini Double Edge Auto Polishing Machine is bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of Max. 2" wafers in double sides at same time, and achieves TTV less one micron in 2" diameter area. It is a idea tool to prepare Si, Ge and oxide single crystal wafer with diameter 2" or less in the laboratory.
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| 1. Grinding disc size: 225mm x 94mm x 15mm 2. Upper grinding disc weight and additional weight: 5.5kg (3kg Additional weight) 3. Gearing template size: z=54 m=1.5 dia.81mm (Epoxy) 4. Max. Gearing templates quantity: 4 5. Max. processing substrate size: dia. 60mm 6. Flatness and parallelism: 0.001mm 7. Grinding and polishing accuracy: +/-0.001mm 8. Surface quality: > grade 10 9. Input power supply: single phase AC 220v 10. Motor: DC110V/600W/0~1500rpm (adjustable) |
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| Size: 615x375x494mm Weight: 80kg | |||
| 1 set (4pcs Gearing templates), not belong optional accessories, but we provide. Size and quantity: 1pcs diameter 60 mm or 2" substrate 3pcs diameter 1" substrate 14pcs 10x10mm substrate If need order, please provide substrate size and thickness after been polished. |
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