Customization: | Available |
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Blade Type: | Continuous Boundary |
Manufacturing Process: | Electroplating |
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Model: | SYJ-150 Low Speed Diamond Saw | ||||||||||||||||||||||||||||||||||||||||||||
Brief Introduction: | SYJ-150 Low Speed Diamond Saw is CE certified, used to precision cut the material samples for researching. Such as crystal, ceramic, glass, rock, mineral, refractory materials, PCB board, metal, building materials, plastic samples etc. | ||||||||||||||||||||||||||||||||||||||||||||
Main Feature: |
Used for precision cutting the material samples, high torque, running steady, can cut the thickness of various materials(0.1mm). Suitable for samples' follow-up thinning, polishing and various operation. | ||||||||||||||||||||||||||||||||||||||||||||
Technical Parameter: |
1. Speed range:20-600RPM stepless speed adjust 2. Voltage:AC 110V/220V 3. Position accuracy:0.01mm(Mechanical and digital display, digital display should be purchased in selection) 4. Two dimension, angle adjustable:spinning 360° 5. Travel distance:50mm(Fine adjustment travel distance 25mm) 6. Max dia. wafer blade:100mm(4 inch) 7. Automatic shut off:allowed unattended 8. Digital display axis RPM |
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Specification: | Size:360×260×260mm Weight:17.5kg | ||||||||||||||||||||||||||||||||||||||||||||
Standard Accessories: |
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Optional Accessories : | 1. Sintered diamond Blade:Φ100mm×12.7mm×0.33mm 2. Electroplating diamond blade:Φ100mm×12.7mm×0.4mm 3. Sic blade:Φ100mm×12.7mm×0.4mm 4. Al2O3 blade:Φ100mm×12.7mm×0.4mm |